The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Jun. 04, 2010
Takaharu Yamano, Nagano, JP;
Takaharu Yamano, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A semiconductor device includes a reinforcement plate having an accommodating hole and a through hole extending from a first surface to a second surface, a semiconductor chip including a chip core and a pad formed on a pad surface of the chip core, the semiconductor chip disposed in the accommodating hole with the pad surface flush with the first surface, the chip core having substantially the same thickness as the reinforcement plate and including a semiconductor substrate, a through-hole electrode disposed in the through hole, resin sealing the semiconductor chip and the reinforcement plate, a interconnection pattern disposed on the first-surface side of the reinforcement plate to connect between the through-hole electrode and the pad, and a interconnection pattern disposed on the second-surface side of the reinforcement plate to be connected to the through-hole electrode, wherein the reinforcement plate is made of the same material as the semiconductor substrate.