The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Oct. 23, 2007
Takaharu Yamano, Nagano, JP;
Tsuyoshi Kobayashi, Nagano, JP;
Takaharu Yamano, Nagano, JP;
Tsuyoshi Kobayashi, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Abstract
In a stacked layer type semiconductor package constructed by stacking a plurality of packages with each other, the plurality of packages include a semiconductor package including: a semiconductor chip; a substrate in which a concave portion has been formed, the semiconductor chip being mounted in the concave portion; and a wiring line structure constructed in such a manner that the wiring line structure can be externally connected to the semiconductor chip at least just above and just under the semiconductor chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile