The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Aug. 14, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Takaharu Yamano, Nagano, JP;

Hajime Iizuka, Nagano, JP;

Hideaki Sakaguchi, Nagano, JP;

Toshio Kobayashi, Nagano, JP;

Tadashi Arai, Nagano, JP;

Tsuyoshi Kobayashi, Nagano, JP;

Tetsuya Koyama, Nagano, JP;

Kiyoaki Iida, Nagano, JP;

Tomoaki Mashima, Nagano, JP;

Koichi Tanaka, Nagano, JP;

Yuji Kunimoto, Nagano, JP;

Takashi Yanagisawa, Nagano, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02B 1/00 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H05K 1/18 (2006.01); H01L 25/16 (2006.01); H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 3/46 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H01L 25/162 (2013.01); H05K 1/185 (2013.01); H05K 1/186 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/85 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1532 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/207 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H05K 3/20 (2013.01); H05K 3/462 (2013.01); H05K 3/4614 (2013.01); H05K 3/4644 (2013.01); H05K 2201/10007 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49146 (2015.01);
Abstract

An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.


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