Tadashi Arai

This inventor holds 29 USPTO granted patents and 2 published patent applications and 3 EPO patents, primarily in Embedded Substrate Technology. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 2007-2019.

USPTO Granted Patents = 29 (Patent Applications = 2)

% Patents Active = 75.9

EPO Patents = 3 (Patent Applications = 3)

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 159(Granted Patents)

Company Filing History:

29 out of 1,704

Shinko Electric Industries Co., Ltd.

patents

Years Active: 2007-2019

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Areas of Expertise:

Wiring Substrate

Embedded Substrate

Semiconductor Device

Electronic Component

Manufacturing Method

Chip Integration

Light-Emitting Device

Magnetic Shield

Electronic Package

Substrate Fabrication

Electronic Apparatus

Mounting Package

29 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10290570 - Wiring substrate (2019-05-14),

2. 10134680 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2018-11-20),

3. 10121695 - Semiconductor device (2018-11-06),

4. 9768122 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2017-09-19),

5. 9490221 - Semiconductor device having multiple magnetic shield members (2016-11-08),

6. 9466784 - Semiconductor device having multiple magnetic shield members (2016-10-11),

7. 9451702 - Chip embedded substrate and method of producing the same (2016-09-20),

8. 9257354 - Wiring substrate, light emitting device, and method for manufacturing wiring substrate (2016-02-09),

9. 8941139 - Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same (2015-01-27),

10. 8901580 - Package for mounting electronic components, electronic apparatus, and method for manufacturing the package (2014-12-02),

11. 8793868 - Chip embedded substrate and method of producing the same (2014-08-05),

12. 8786065 - Substrate, light emitting device and method for manufacturing substrate (2014-07-22),

13. 8686548 - Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate (2014-04-01),

14. 8674514 - Wiring board, manufacturing method of the wiring board, and semiconductor package (2014-03-18),

15. 8610268 - Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element (2013-12-17),

Title: Tadashi Arai - Innovative Inventor from Nagano, Japan

Introduction: Tadashi Arai is a renowned inventor hailing from Nagano, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tadashi Arai holds several patents in the areas of robotics, artificial intelligence, and sustainable energy solutions, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Tadashi Arai has worked with leading research institutions and tech companies, consistently pushing the boundaries of what is possible in the world of technology.

Collaborations: Throughout his career, Tadashi Arai has collaborated with top engineers, scientists, and designers from around the globe, fostering a culture of innovation and creativity in all his projects.

Conclusion: Tadashi Arai's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology, inspiring future generations of inventors to dream big and think outside the box.