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For the Inventor, By the Inventor

Nagano, Japan

Tadashi Arai

This inventor holds 29 USPTO granted patents and 2 published patent applications and 3 EPO patents, primarily in Embedded Substrate Technology. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 2007-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tadashi Arai. Retrieved from https://idiyas.com/inventor/tadashi-arai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 75.9

 

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 159(Granted Patents)


Company Filing History:

goldMedal29 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents

Years Active: 2007-2019

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Areas of Expertise:
Wiring Substrate
Embedded Substrate
Semiconductor Device
Electronic Component
Manufacturing Method
Chip Integration
Light-Emitting Device
Magnetic Shield
Electronic Package
Substrate Fabrication
Electronic Apparatus
Mounting Package
29 patents (USPTO):Explore Patents
1. 10290570 - Wiring substrate (2019-05-14),
2. 10134680 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2018-11-20),
3. 10121695 - Semiconductor device (2018-11-06),
4. 9768122 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2017-09-19),
5. 9490221 - Semiconductor device having multiple magnetic shield members (2016-11-08),
6. 9466784 - Semiconductor device having multiple magnetic shield members (2016-10-11),
7. 9451702 - Chip embedded substrate and method of producing the same (2016-09-20),
8. 9257354 - Wiring substrate, light emitting device, and method for manufacturing wiring substrate (2016-02-09),
9. 8941139 - Light-emitting element mounting package, light-emitting element package, and method of manufacturing the same (2015-01-27),
10. 8901580 - Package for mounting electronic components, electronic apparatus, and method for manufacturing the package (2014-12-02),
11. 8793868 - Chip embedded substrate and method of producing the same (2014-08-05),
12. 8786065 - Substrate, light emitting device and method for manufacturing substrate (2014-07-22),
13. 8686548 - Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate (2014-04-01),
14. 8674514 - Wiring board, manufacturing method of the wiring board, and semiconductor package (2014-03-18),
15. 8610268 - Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element (2013-12-17),

Title: Tadashi Arai - Innovative Inventor from Nagano, Japan

Introduction: Tadashi Arai is a renowned inventor hailing from Nagano, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Tadashi Arai holds several patents in the areas of robotics, artificial intelligence, and sustainable energy solutions, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Tadashi Arai has worked with leading research institutions and tech companies, consistently pushing the boundaries of what is possible in the world of technology.

Collaborations: Throughout his career, Tadashi Arai has collaborated with top engineers, scientists, and designers from around the globe, fostering a culture of innovation and creativity in all his projects.

Conclusion: Tadashi Arai's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of technology, inspiring future generations of inventors to dream big and think outside the box.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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