The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Nov. 02, 2012
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-ken, JP;

Inventors:

Yasuyuki Kimura, Nagano, JP;

Tadashi Arai, Nagano, JP;

Tsuyoshi Kobayashi, Nagano, JP;

Toshiyuki Okabe, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/642 (2013.01); H01L 2224/45147 (2013.01); H01L 24/45 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/48091 (2013.01); H01L 25/0753 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/45144 (2013.01);
Abstract

A substrate includes a first lead frame, a second lead frame, and a resin layer. The first lead frame includes a heat sink and a plurality of electrodes for external connection. The second lead frame is laminated on the first lead frame and includes a plurality of wirings for mounting light emitting elements. The resin layer is filled between the first lead frame and the second lead frame. The plurality of wirings are arranged above the heat sink. The plurality of electrodes and part of the plurality of wirings are joined with each other.


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