The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Dec. 22, 2017
Shinko Electric Industries Co., Ltd., Nagano, JP;
Tadashi Arai, Nagano, JP;
Yoshikazu Hirabayashi, Nagano, JP;
Hidetoshi Arai, Nagano, JP;
Tadashi Kodaira, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor device includes a wiring substrate, a semiconductor chip, conductive paste, and an adhesive layer. The wiring substrate includes an insulating layer and a wiring layer on a surface of the insulating layer. The semiconductor chip includes a circuit-formation surface in which an electrode pad is provided, and is mounted on the wiring substrate with the circuit-formation surface facing toward the wiring layer. The conductive paste electrically connects the wiring layer and the electrode pad. The adhesive layer is over the entirety of the surface of the insulating layer, and covers the wiring layer and the conductive paste. The adhesive layer fills in a gap between the surface of the insulating layer and the circuit-formation surface, to bond the wiring substrate and the semiconductor chip. The adhesive layer extends onto a side surface of the semiconductor chip to form a fillet.