The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Nov. 20, 2012
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Tadashi Arai, Nagano, JP;

Yasuyuki Kimura, Nagano, JP;

Toshio Kobayashi, Nagano, JP;

Kazutaka Kobayashi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 21/50 (2006.01); H01L 23/495 (2006.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 27/15 (2013.01); H01L 23/49568 (2013.01); H01L 21/50 (2013.01); H01L 25/0753 (2013.01); H01L 24/19 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/01047 (2013.01);
Abstract

A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively.


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