The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Dec. 04, 2012
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Kazutaka Kobayashi, Nagano, JP;

Tadashi Arai, Nagano, JP;

Yasuyuki Kimura, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H05K 3/24 (2006.01); H05K 3/10 (2006.01); H01L 33/60 (2010.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 3/28 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H05K 1/056 (2013.01); H05K 3/242 (2013.01); H05K 3/284 (2013.01); H05K 3/108 (2013.01); H05K 2201/2054 (2013.01); H01L 2224/73265 (2013.01); H01L 33/62 (2013.01); H05K 2201/10106 (2013.01); H01L 2224/16225 (2013.01); H05K 1/0274 (2013.01); H01L 25/0753 (2013.01); H01L 2224/48091 (2013.01); H05K 3/243 (2013.01);
Abstract

A method of manufacturing a light-emitting element mounting package including laminating a metallic layer on an insulating layer; forming a light-emitting element mounting area which includes a pair of electroplating films formed by electroplating using the metallic layer as a power supply layer on the metallic layer; forming a light-emitting element mounting portion in which a plurality of wiring portions are separated by predetermined gaps, by removing predetermined portions of the metallic layer, wherein, in the forming the light-emitting element mounting portion, the metallic layer is removed so that one of the pair of electroplating films belongs to one wiring portion of the plurality of wiring portions and another of the pair of electroplating films belongs to another wiring portion adjacent to the one wiring portion.


Find Patent Forward Citations

Loading…