The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2016
Filed:
Oct. 19, 2012
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Inventors:
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/14 (2006.01); H01L 25/075 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 23/142 (2013.01); H01L 23/49894 (2013.01); H01L 23/562 (2013.01); H01L 25/0753 (2013.01); H01L 24/45 (2013.01); H01L 33/60 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H05K 2201/09409 (2013.01);
Abstract
A wiring substrate includes a substrate, a first insulating layer formed on the substrate, wiring patterns formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer. The second insulating layer covers the wiring patterns and includes a first opening that partially exposes adjacent wiring patterns as a pad. A projection is formed in an outer portion of the substrate located outward from where the first opening is arranged. The projection rises in a thickness direction of the substrate.