The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Jan. 10, 2018
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Tadashi Arai, Nagano, JP;

Yoshikazu Hirabayashi, Nagano, JP;

Hidetoshi Arai, Nagano, JP;

Tadashi Kodaira, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4867 (2013.01); H05K 1/0373 (2013.01); H05K 1/112 (2013.01); H05K 1/14 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81 (2013.01); H05K 1/0284 (2013.01);
Abstract

A wiring substrate includes a first substrate and a second substrate stacked on the first substrate. The first substrate includes a first adhesive layer and conductive paste. The first adhesive layer is on a surface of a first insulating layer. The conductive paste is in an opening in the first adhesive layer. The second substrate includes a second adhesive layer and a protruding electrode. The second adhesive layer is on a surface of a second insulating layer facing toward the first substrate, and is bonded to the first adhesive layer. The protruding electrode has an end uncovered by the second adhesive layer, and is electrically connected to the conductive paste.


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