IDiyas

For the Inventor, By the Inventor

Nagano, Japan

Tetsuya Koyama

USPTO Granted Patents = 16

Average Co-Inventor Count = 4.5

ph-index = 5

Forward Citations = 130(Granted Patents)


Company Filing History:

goldMedal16 out of 1,694 
 
Shinko Electric Industries Co., Ltd.
 patents

Years Active: 2009-2018

Loading Chart...
16 patents (USPTO):Explore Patents
1. 10134680 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2018-11-20),
2. 9768122 - Electronic part embedded substrate and method of producing an electronic part embedded substrate (2017-09-19),
3. 9451702 - Chip embedded substrate and method of producing the same (2016-09-20),
4. 9257386 - Wiring substrate and semiconductor device (2016-02-09),
5. 9137900 - Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate (2015-09-15),
6. 9059088 - Electronic component built-in substrate (2015-06-16),
7. 8793868 - Chip embedded substrate and method of producing the same (2014-08-05),
8. 8736053 - Semiconductor device (2014-05-27),
9. 8096049 - Method of manufacturing a multilayer wiring board (2012-01-17),
10. 7989707 - Chip embedded substrate and method of producing the same (2011-08-02),
11. 7955454 - Method for forming wiring on insulating resin layer (2011-06-07),
12. 7884484 - Wiring board and method of manufacturing the same (2011-02-08),
13. 7882627 - Method of manufacturing a multilayer wiring board (2011-02-08),
14. 7847384 - Semiconductor package and manufacturing method thereof (2010-12-07),
15. 7772689 - Semiconductor package with a conductive post and wiring pattern (2010-08-10),

Title: The Innovative Contributions of Tetsuya Koyama

Introduction

Tetsuya Koyama, an esteemed inventor based in Nagano, Japan, has made significant strides in the field of electronic component technology. With a remarkable portfolio of 16 patents to his name, Koyama has been instrumental in advancing electronic part embedded substrates.

Latest Patents

Koyama's latest inventions include a groundbreaking electronic part embedded substrate and a method of producing it. This innovative substrate consists of a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. The production method involves mounting an electronic part onto the first substrate, laminating the second substrate through an electrically connecting member, and sealing the electronic part using a sealing member to fill the space between the substrates. This innovation enhances the integration and reliability of electronic components.

Career Highlights

Tetsuya Koyama has been a valuable member of Shinko Electric Industries Co., Ltd., a leading company in the electronic manufacturing industry. His extensive experience and creativity have contributed to the development of multiple cutting-edge technologies. Koyama's dedication to innovation is evident in his prolific patent filings.

Collaborations

Throughout his career, Koyama has collaborated with fellow inventors Tsuyoshi Kobayashi and Takaharu Yamano. Together, they have shared insights and ideas that have fostered a collaborative environment, resulting in advancements in electronic substrate technologies.

Conclusion

As an inventor, Tetsuya Koyama exemplifies the spirit of innovation and creativity in technology. His contributions, particularly in electronic part embedded substrates, continue to influence the industry. With a proven track record of patents and successful collaborations, Koyama's work at Shinko Electric Industries Co., Ltd. surely leaves a lasting impact on the future of electronics.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…