The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Mar. 10, 2006
Applicants:
Takaharu Yamano, Nagano, JP;
Masahiro Sunohara, Nagano, JP;
Hajime Iizuka, Nagano, JP;
Tetsuya Koyama, Nagano, JP;
Inventors:
Takaharu Yamano, Nagano, JP;
Masahiro Sunohara, Nagano, JP;
Hajime Iizuka, Nagano, JP;
Tetsuya Koyama, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.