The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7884484 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 08, 2011

Filed:

Mar. 10, 2006
Applicants:

Takaharu Yamano, Nagano, JP;

Masahiro Sunohara, Nagano, JP;

Hajime Iizuka, Nagano, JP;

Tetsuya Koyama, Nagano, JP;

Inventors:

Takaharu Yamano, Nagano, JP;

Masahiro Sunohara, Nagano, JP;

Hajime Iizuka, Nagano, JP;

Tetsuya Koyama, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.


Find Patent Forward Citations

Yamano, Takaharu. (2011). Wiring board and method of manufacturing the same (U.S. Patent No. 7884484). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7884484

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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