The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Jun. 19, 2012
Koichi Tanaka, Nagano, JP;
Nobuyuki Kurashima, Nagano, JP;
Hajime Iizuka, Nagano, JP;
Tetsuya Koyama, Nagano, JP;
Koichi Tanaka, Nagano, JP;
Nobuyuki Kurashima, Nagano, JP;
Hajime Iizuka, Nagano, JP;
Tetsuya Koyama, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Abstract
A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad.