The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2010
Filed:
Aug. 17, 2006
Applicants:
Tsuyoshi Kobayashi, Nagano, JP;
Tetsuya Koyama, Nagano, JP;
Takaharu Yamano, Nagano, JP;
Inventors:
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor packageis constructed of a semiconductor chip, a sealing resinfor sealing this semiconductor chip, and wiringformed inside the sealing resin. And, the wiringis constructed of pattern wiringconnected to the semiconductor chipand also formed so as to be exposed to a lower surfaceof the sealing resin, and a post partformed so as to extend in a thickness direction of the sealing resin, the post part in which one end is connected to the pattern wiringand also the other end is formed so as to be exposed to an upper surfaceof the sealing resin