The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Jan. 04, 2008
Tetsuya Koyama, Nagano, JP;
Tsuyoshi Kobayashi, Nagano, JP;
Hiroyuki Kato, Nagano, JP;
Yoshihiro Machida, Nagano, JP;
Tetsuya Koyama, Nagano, JP;
Tsuyoshi Kobayashi, Nagano, JP;
Hiroyuki Kato, Nagano, JP;
Yoshihiro Machida, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-Shi, JP;
Abstract
First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer boards are prepared and stacked up. On that case, the board disposed in the uppermost layer is prepared without having a metal bump. The boards are positioned and stacked up in such a manner that a metal bump of one of adjacent boards is connected to a corresponding wiring layer of the other board. Thereafter, resin is filled into gaps between the stacked boards, and insulating layers are formed on both sides of a multilayer board obtained through the above steps, in such a manner as to cover the entire surface except pad areas defined at predetermined positions on the wiring layers.