The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Oct. 25, 2010
Toshio Gomyo, Nagano, JP;
Yukiharu Takeuchi, Nagano, JP;
Hidenori Takayanagi, Nagano, JP;
Takaharu Yamano, Nagano, JP;
Toshio Gomyo, Nagano, JP;
Yukiharu Takeuchi, Nagano, JP;
Hidenori Takayanagi, Nagano, JP;
Takaharu Yamano, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A method of manufacturing an electronic parts packaging structure including the steps of preparing a plurality of sheet-like units each of which is constructed by a first insulating layer, a wiring formed on one surface of the first insulating layer, electronic parts connected to the wiring, a second insulating layer formed on an one surface side of the first insulating layer to cover the electronic parts, and a connecting portion for connecting electrically the wiring, and stacking mutually the units to arrange directions of unit adjacent in a thickness direction alternately oppositely, and bonding the units such that electronic parts of respective units are electrically connected mutually via connecting portions.