The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Nov. 10, 2022
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Hitoshi Ito, Nagano, JP;

Kenichi Koi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); H01L 21/4825 (2013.01); H01L 21/4839 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 23/4985 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 25/074 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32059 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A semiconductor device includes: a first semiconductor element; a second semiconductor element; a first insulating base member adhesively bonded to the first semiconductor element; a first wiring connected to a first electrode of the first semiconductor element, and disposed on the first insulating base member; a second insulating base member adhesively bonded to the second semiconductor element, a second wiring connected to a third electrode of the second semiconductor element, and disposed on the second insulating base member; a first wiring member connected to a second electrode of the first semiconductor element; a second wiring member electrically connected to the first wiring and a fourth electrode of the second semiconductor element; and a third wiring member connected to the second wiring. A current flows in a first direction in the first wiring member, and flows in a second direction opposite to the first direction in the third wiring member.


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