The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Jun. 23, 2023
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Shuhei Momose, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD, Nagano-Ken, JP;
Abstract
A wiring substrate includes a wiring layer, a protective insulation layer covering the wiring layer, an opening extending through the protective insulation layer and partially exposing an upper surface of the wiring layer, a first plating layer formed inside the opening on the wiring layer that is exposed in the opening, a gap extending between a side surface of the first plating layer and a wall surface of the opening, and a second plating layer entirely covering a surface of the first plating layer in the opening of the protective insulation layer. The first plating layer is formed from nickel or a nickel alloy. The second plating layer is formed from a metal having a higher resistance to oxidation than the metal forming the first plating layer. The second plating layer entirely covers a side surface of the first plating layer that is exposed in the gap.