The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jun. 13, 2023
Shinko Electric Industries Co., Ltd., Nagano-ken, JP;
Yoichi Nishihara, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD, Nagano-ken, JP;
Abstract
A semiconductor device includes a lower substrate, a first wiring pattern disposed on the lower substrate with a current input terminal, a semiconductor element mounted on the lower substrate with a first electrode electrically connected to the first wiring pattern and a second electrode opposed to the first wiring pattern, an upper substrate disposed on the second electrode, via wirings extending through the upper substrate and connected to the second electrode, a second wiring pattern disposed on the upper substrate and electrically connected to the second electrode via the via wirings, and a current output terminal. The second wiring pattern is electrically connected to the current output terminal and extends from the second electrode toward the current output terminal in plan view. Among the via wirings, first via wirings closest to the current output terminal are larger than second via wirings adjacent to the first via wirings in plan view.