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For the Inventor, By the Inventor

Nagano, Japan

Yuichi Taguchi

This inventor holds 47 USPTO granted patents and 14 EPO patents, primarily in Semiconductor Packaging. Top assignees: Shinko Electric Industries Co., Ltd., Citizen Holdings Company, Ltd., Citizen Systems Japan Co., Ltd.. Active years: 2008-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuichi Taguchi. Retrieved from https://idiyas.com/inventor/yuichi-taguchi-cz7mp0tv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47

% Patents Active = 57.4

 

Average Co-Inventor Count = 4.2

ph-index = 8

Forward Citations = 229(Granted Patents)


Location History:

  • Nagano, JP (2008 - 2016)
  • Iida, JP (2014 - 2020)

Company Filing History:

goldMedal43 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents
silverMedal3 out of 450 
 
Citizen Holdings Company, Ltd.
 patents
bronzeMedal3 out of 57 
 
Citizen Systems Japan Co., Ltd.
 patents
4. 1 out of 2,004 
 
Citizen Watch Company, Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2008-2020

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Areas of Expertise:
Semiconductor Package
Manufacturing Method
Electronic Component
Wiring Substrate
Optical Waveguide
Light-Emitting Device
Heat Radiation Package
Silicon Substrate
Probe Card
Lighting Apparatus
Sensing Apparatus
Interposer
47 patents (USPTO):Explore Patents
1. 10632769 - Printer (2020-04-28),
2. 9481183 - Printer (2016-11-01),
3. 8878357 - Electronic component device, method of manufacturing the same and wiring substrate (2014-11-04),
4. 8827440 - Printer (2014-09-09),
5. 8564077 - Package for electronic component, manufacturing method thereof and sensing apparatus (2013-10-22),
6. 8532457 - Method of manufacturing optical waveguide, optical waveguide and optical transmission device (2013-09-10),
7. 8368206 - Heat radiation package and semiconductor device (2013-02-05),
8. 8334461 - Wiring board and electronic component device (2012-12-18),
9. 8304862 - Semiconductor package and manufacturing method of the same (2012-11-06),
10. 8299623 - Semiconductor package (2012-10-30),
11. 8227909 - Semiconductor package and method of manufacturing the same (2012-07-24),
12. 8212355 - Semiconductor package and manufacturing method of the semiconductor package (2012-07-03),
13. 8178957 - Electronic component device, and method of manufacturing the same (2012-05-15),
14. 8148738 - Semiconductor device having an element mounted on a substrate and an electrical component connected to the element (2012-04-03),
15. 8106484 - Silicon substrate for package (2012-01-31),

Title: The Innovative Journey of Yuichi Taguchi

Introduction: Yuichi Taguchi, a visionary inventor hailing from Nagano, Japan, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Yuichi Taguchi holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Taguchi has worked with leading research institutions and tech companies to develop cutting-edge solutions that have revolutionized various industries. His commitment to pushing the boundaries of technology is evident in the numerous accolades and awards he has received throughout his career.

Collaborations: Taguchi has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of innovation and creativity. His ability to work seamlessly in multidisciplinary teams has led to the successful development of several groundbreaking products and technologies.

Conclusion: In conclusion, Yuichi Taguchi's passion for innovation, coupled with his technical expertise, has solidified his position as a trailblazer in the world of technology. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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