The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Dec. 22, 2009
Yuichi Taguchi, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Akinori Shiraishi, Nagano, JP;
Hideaki Sakaguchi, Nagano, JP;
Masahiro Sunohara, Nagano, JP;
Yuichi Taguchi, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Akinori Shiraishi, Nagano, JP;
Hideaki Sakaguchi, Nagano, JP;
Masahiro Sunohara, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
A semiconductor package includes: a wiring board; and a semiconductor device which is formed on the wiring board; wherein the semiconductor device includes: a semiconductor chip; and a penetration electrode, one end of which is fixed on one plane of the semiconductor chip, and the other end of which penetrates the semiconductor chip and is fixed on the other plane of the semiconductor chip, the penetration electrode penetrating the semiconductor chip in such a manner that the penetration electrode is not contacted to a wall plane of the semiconductor chip by a space portion formed in the semiconductor chip; and the wiring board and the semiconductor device are electrically connected via the penetration electrode.