Shinko Electric Industries Co., Ltd.

Citizen Holdings Company, Ltd.

Citizen Systems Japan Co., Ltd.

Citizen Watch Company, Ltd.

Yuichi Taguchi

Akinori Shiraishi

Masahiro Sunohara

Mitsutoshi Higashi

Kei Murayama

Hideaki Sakaguchi

Naoyuki Koizumi

Akira Takahashi

Takeshi Yamazaki

Yutaka Inokuchi

Kiyoshi Oi

Teruaki Chino

Shinya Hosoda

Mitsutoshi Higashii

A printer includes a recording medium holding unit that holds a long, wound strip-like recording medium to enable the recording medium to be pulled out from a front end thereof, a recording unit that pulls out the recording medium held by the recording medium holding unit to a side higher in a vertical direction than a position for pulling out from the recording medium holding unit and that executes a recording operation for the pulled-out recording medium, and a second cutter mechanism disposed under the recording medium holding unit and that cuts the recording medium for which the recording operation is executed by the recording unit at the back end thereof separated from the front end by a predetermined length. A drawing position of the recording medium into an inversion path is arranged to be lower than the recording medium holding unit and the recording unit in the vertical direction.

Printer

Provided is a printer in which the rotating shaft of a ribbon roller can be connected to its driving unit with high accuracy by using a mechanism simple in structure, while preventing breakage that may occur when connecting the rotating shaft to the driving unit. The printer () includes a cabinet (), a drawer unit () which can be drawn out of the cabinet, a ribbon roller (A,B) on which a belt-like ink ribbon used for transferring to a recording sheet is wound, a driving unit (A,B) which drives the ribbon roller for rotation by being connected to a rotating shaft (A,B) of the ribbon roller when the drawer unit is loaded in the cabinet, and a disengaging member () which is provided on the cabinet and which disengages the driving unit from the rotating shaft when the drawer unit is drawn out of the cabinet.

An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post.

Electronic component device, method of manufacturing the same and wiring substrate

A printer includes a printer unit that performs a recording operation on a recording medium pulled out from a first recording medium holding unit and on a recording medium held by a second recording medium holding unit included in a paper-feeding/paper-reversing unit. The paper-feeding/paper-reversing unit has a third recording medium transportation path in which the side of the recording medium to be subject to simplex recording is switched and through which the recording medium is fed back to a recording unit of the printer unit. The third recording medium transportation path partially overlaps a second recording medium transportation path through which the recording medium is fed to the printer unit.

A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.

Package for electronic component, manufacturing method thereof and sensing apparatus

A method for manufacturing an optical waveguide which includes a core configured to transmit an optical signal, and a mirror portion configured to reflect the optical signal, the method includes: forming a mask layer patterned in a predetermined shape, on a first crystal plane of a substrate made of a crystalline material; etching the first crystal plane by a wet-etching using the mask layer to form a groove having a plurality of crystal planes; providing a metallic reflection film on at least one of the plurality of crystal planes to form the mirror portion; and providing the groove with a core material to form the core.

Method of manufacturing optical waveguide, optical waveguide and optical transmission device

A heat radiation package of the present invention includes a substrate in an upper surface side of which recess portion is provided, embedded wiring portion which is filled in the recess portion of the substrate and on which semiconductor element which generates a heat is mounted, and a heat sink connected to a lower surface side of the substrate. The substrate is made of silicon, ceramics, or insulating resin.

Heat radiation package and semiconductor device

A wiring board adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween and are interconnected through via holes formed in the insulating layers, respectively. A plurality of openings are formed through the structure in a region where a wiring is not formed, extending through the structure in a thickness direction thereof. Further, solder resist layers are formed on the outermost wiring layers, respectively, and exposing pad portions defined in desired locations in the outermost wiring layers.

Wiring board and electronic component device

A semiconductor package includes: a wiring board; and a semiconductor device which is formed on the wiring board; wherein the semiconductor device includes: a semiconductor chip; and a penetration electrode, one end of which is fixed on one plane of the semiconductor chip, and the other end of which penetrates the semiconductor chip and is fixed on the other plane of the semiconductor chip, the penetration electrode penetrating the semiconductor chip in such a manner that the penetration electrode is not contacted to a wall plane of the semiconductor chip by a space portion formed in the semiconductor chip; and the wiring board and the semiconductor device are electrically connected via the penetration electrode.

Semiconductor package and manufacturing method of the same

A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. The semiconductor device includes a semiconductor substrate and a penetration electrode penetrating the semiconductor substrate. A cavity part is formed in the semiconductor substrate to isolate the penetration electrode from the semiconductor substrate. A connection terminal is provided at a position where the connection terminal does not overlap the penetration electrode in a plan view. The connection terminal electrically connects the semiconductor device to the wiring board.

Semiconductor package

There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a silicon wafer comprising a first surface and a second surface opposite to the first surface; (b) forming vias through the silicon wafer in its thickness direction; (c) forming wiring patterns on the first surface of the silicon wafer such that the wiring patterns are electrically connected to the vias; (d) bonding a MEMS element wafer comprising MEMS elements onto the second surface of the silicon wafer such that the MEMS elements are electrically connected to the vias; (e) dividing the MEMS element wafer into the respective MEMS elements; (f) bonding a lid having concave portions therein onto the second surface of the silicon wafer such that the respective MEMS elements face a corresponding one of the concave portions; and (g) dicing the lid and the silicon wafer.

Semiconductor package and method of manufacturing the same

A semiconductor package includes a semiconductor device, and a wiring board where the semiconductor device is mounted. The semiconductor device includes a semiconductor substrate, a piercing electrode configured to pierce the semiconductor substrate and electrically connect the wiring board and the semiconductor device, and a ring-shaped concave part provided so as to surround the piercing electrode, the ring-shaped concave part being configured to open to a wiring board side of the semiconductor substrate.

Semiconductor package and manufacturing method of the semiconductor package

A method of manufacturing an electronic component device, includes the steps of preparing a wiring substrate, which includes a silicon substrate, a concave portion provided on its upper surface side, a through hole formed to penetrate the silicon substrate on a bottom surface side of the concave portion, an insulating layer formed on the silicon substrate, a penetration electrode constructed by a lower conductor portion formed to a halfway position of a height direction from a bottom portion of the through hole and a connection metal member (indium layer) formed on the lower conductor portion in the through hole, and an electronic component having a terminal metal member (gold bump) on a lower surface side, and softening the connection metal member of the wiring substrate in a heating atmosphere and then sticking the terminal metal member of the electronic component into the connection metal member and connecting thereto.

Electronic component device, and method of manufacturing the same

In a semiconductor device, a light emitting elementhas been mounted on an upper plane of a semiconductor substrate. In an impurity diffusion region of the semiconductor substrate, a P conducting type of a layer, and an N layerhave been formed, while an N conducting type impurity is implanted to the P layer, and then the implanted impurity is diffused to constitute the N layer. A zener diodemade of a semiconductor device has been formed by the P layerand the N layer

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element

In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity.

Growing community of inventors

Nagano, Japan

Yuichi Taguchi