The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2013

Filed:

Dec. 21, 2009
Applicants:

Akinori Shiraishi, Nagano, JP;

Masahiro Sunohara, Nagano, JP;

Hideaki Sakaguchi, Nagano, JP;

Yuichi Taguchi, Nagano, JP;

Mitsutoshi Higashi, Nagano, JP;

Inventors:

Akinori Shiraishi, Nagano, JP;

Masahiro Sunohara, Nagano, JP;

Hideaki Sakaguchi, Nagano, JP;

Yuichi Taguchi, Nagano, JP;

Mitsutoshi Higashi, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 23/52 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.


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