The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2014
Filed:
Aug. 30, 2011
Applicants:
Yuichi Taguchi, Nagano, JP;
Akinori Shiraishi, Nagano, JP;
Mitsutoshi Higashi, Nagano, JP;
Inventors:
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 21/50 (2006.01); H01L 21/683 (2006.01); H01L 23/10 (2006.01); B81B 7/00 (2006.01); H01L 23/055 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 24/16 (2013.01); H01L 21/50 (2013.01); H01L 2924/01079 (2013.01); H01L 21/6835 (2013.01); H01L 2224/0401 (2013.01); H01L 2924/01006 (2013.01); H01L 2224/81192 (2013.01); H01L 2924/014 (2013.01); H01L 24/81 (2013.01); H01L 2224/81444 (2013.01); H01L 2924/01049 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/01057 (2013.01); B81B 7/0048 (2013.01); B81C 2203/019 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/81409 (2013.01); H01L 23/13 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/13109 (2013.01); H01L 2221/68372 (2013.01); H01L 2924/01005 (2013.01); H01L 23/055 (2013.01); H01L 24/13 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/01082 (2013.01);
Abstract
An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post.