The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 2010
Filed:
Nov. 10, 2004
Neil Mclellan, Danville, CA (US);
Katherine Wagenhoffer, Union City, CA (US);
Geraldine Tsui Yee Lin, Tung Tau Est, KLN, HK;
Mohan Kirloskar, Cupertino, CA (US);
Neil McLellan, Danville, CA (US);
Katherine Wagenhoffer, Union City, CA (US);
Geraldine Tsui Yee Lin, Tung Tau Est, KLN, HK;
Mohan Kirloskar, Cupertino, CA (US);
Other;
Abstract
A process for fabricating a cavity-type integrated circuit includes supporting a leadframe strip in a mold. The leadframe strip includes a die attach pad and a row of contact pads circumscribing the die attach pad. A package body is molded in the mold such that opposing surfaces of the die attach pad and of the contact pads are exposed. A semiconductor die is mounted to the die attach pad. Various ones of the contact pads are wire bonded to the semiconductor die and a lid is mounted on the package body to thereby enclose the semiconductor die and the wire bonds in a cavity of the integrated circuit package.