Union City, CA, United States of America

Katherine Wagenhoffer


Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 175(Granted Patents)


Company Filing History:


Years Active: 2008-2010

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3 patents (USPTO):Explore Patents

Title: Katherine Wagenhoffer: Innovator in Integrated Circuit Packaging

Introduction

Katherine Wagenhoffer is a prominent inventor based in Union City, CA (US). She has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. Her innovative approaches have advanced the technology used in semiconductor devices.

Latest Patents

Wagenhoffer's latest patents include a process for fabricating a cavity-type integrated circuit package. This process involves supporting a leadframe strip in a mold, which includes a die attach pad and a row of contact pads. The package body is molded in such a way that the opposing surfaces of the die attach pad and contact pads are exposed. A semiconductor die is then mounted to the die attach pad, and various contact pads are wire bonded to the semiconductor die. A lid is subsequently mounted on the package body to enclose the semiconductor die and wire bonds within the cavity of the integrated circuit package.

Another notable patent is for an integrated circuit package and method for fabricating the same. This process includes selectively etching a substrate to define contact pads, adding a dielectric material, and mounting a semiconductor die to the package base. A lid is fixed to cover the semiconductor die, creating a cavity between the lid and the package base, followed by singulation to provide the integrated circuit package.

Career Highlights

Throughout her career, Katherine has worked with A-sat Corporation, where she has honed her skills in integrated circuit technology. Her work has been instrumental in developing efficient packaging solutions for semiconductor devices.

Collaborations

Katherine has collaborated with notable professionals in her field, including Mohan Kirloskar and Leo M. Higgins, III. These collaborations have contributed to her innovative work and the advancement of integrated circuit packaging technology.

Conclusion

Katherine Wagenhoffer is a trailblazer in the field of integrated circuit packaging, with a strong portfolio of patents that reflect her innovative spirit. Her contributions continue to shape the future of semiconductor technology.

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