The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
May. 14, 2007
Mohan Kirloskar, Cupertino, CA (US);
Katherine Wagenhoffer, Union City, CA (US);
Leo M. Higgins, Iii, Austin, TX (US);
Mohan Kirloskar, Cupertino, CA (US);
Katherine Wagenhoffer, Union City, CA (US);
Leo M. Higgins, III, Austin, TX (US);
ASAT Ltd., Tsuen Wan, New Territories, HK;
Abstract
A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a plurality of contact pads; adding a dielectric material to the etched regions of the substrate; selectively etching a second side of the substrate to further define at least the plurality of contact pads and thereby provide a package base of at least the contact pads and the dielectric; mounting a semiconductor die to the package base and connecting the semiconductor die to the contact pads; fixing a lid to the package base to cover the semiconductor die in a cavity between the lid and the package base; and singulating to provide the integrated circuit package.