Geraldine Tsui Yee Lin

Title: Geraldine Tsui Yee Lin: Innovator in Integrated Circuit Packaging

Introduction

Geraldine Tsui Yee Lin is a prominent inventor based in Hong Kong, known for her significant contributions to the field of integrated circuit packaging. With a total of six patents to her name, she has made remarkable advancements in the technology that underpins modern electronics.

Latest Patents

Geraldine's latest patents include a method of fabricating an integrated circuit (IC) package that features a plurality of spaced apart pad portions. This innovative process involves selectively etching a leadframe strip to define a die attach pad and multiple contact pads. A semiconductor die is mounted to the die attach pad, with wires bonded from the semiconductor die to the respective contact pads. The first surface of the leadframe strip, which includes the semiconductor die and wire bonds, is encapsulated in a molding material, ensuring that at least one surface of the leadframe strip remains exposed. Additionally, her patent for an integrated circuit package highlights the same features, emphasizing the importance of solder paste on the contact pads and the die attach pad.

Career Highlights

Throughout her career, Geraldine has worked with notable companies such as A-sat Corporation and Utac Hong Kong Limited. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking innovations in the field of integrated circuits.

Collaborations

Geraldine has collaborated with talented individuals in her field, including Neil McLellan and Chun Ho Fan. These partnerships have fostered an environment of creativity and innovation, leading to the development of advanced technologies.

Conclusion

Geraldine Tsui Yee Lin stands out as a leading inventor in integrated circuit packaging, with her patents reflecting her expertise and dedication to innovation. Her work continues to influence the electronics industry, paving the way for future advancements.