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Forward Citations = 43

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14 inventors (with patents filed for the assignee):

Serafin Padilla Pedron, Jr (5 out of 10 patents)

Kirk Powell (5 out of 5 patents)

John McMillan (5 out of 5 patents)

4. Adonis Fung (5 out of 5 patents)

5. Kwok Cheung Tsang (3 out of 23 patents)

6. Neil McLellan (3 out of 31 patents)

7. Ming Wang Sze (2 out of 9 patents)

8. Wing Keung Lam (2 out of 6 patents)

9. Wai Kit Tam (2 out of 2 patents)

10. Geraldine Tsui Yee Lin (1 out of 6 patents)

11. Walter De Munnik (1 out of 2 patents)

12. Wing Him Lau (1 out of 16 patents)

13. Chun Ho Fan (1 out of 51 patents)

14. Kin Pui Kwan (1 out of 18 patents)

8 patents: Sort by Forward Citations

1. 9449903 - Ball grid array package with improved thermal characteristics (2016-09-20),

2. 9305889 - Leadless integrated circuit package having standoff contacts and die attach pad (2016-04-05),

3. 8828801 - Leadless array plastic package with various IC packaging configurations (2014-09-09),

4. 8736037 - Leadless integrated circuit package having standoff contacts and die attach pad (2014-05-27),

5. 8610262 - Ball grid array package with improved thermal characteristics (2013-12-17),

6. 8486762 - Leadless array plastic package with various IC packaging configurations (2013-07-16),

7. 8330270 - Integrated circuit package having a plurality of spaced apart pad portions (2012-12-11),

8. 7858443 - Leadless integrated circuit package having standoff contacts and die attach pad (2010-12-28),

UTAC is a leading provider of semiconductor assembly and testing services for a wide range of consumer, communication and computing devices. With state-of-the-art facilities and cutting-edge technology, UTAC delivers high-quality and reliable wafer level chip scale packaging solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

8 Patents

#386 in Hong Kong

#3,057 in China

Hong Kong, China

Utac Hong Kong Limited