The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jun. 12, 2013
Applicant:
Utac Hong Kong Limited, Tsuen Wan, CN;
Inventors:
John McMillan, Seaview, WA (US);
Serafin P. Pedron, Jr., Manteca, CA (US);
Kirk Powell, Greeley, CO (US);
Adonis Fung, Tsing Yi, HK;
Assignee:
UTAC Hong Kong Limited, Tsuen Wan, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4832 (2013.01); H01L 2924/01046 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/48257 (2013.01); H01L 24/49 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/01078 (2013.01); H01L 23/49575 (2013.01); H01L 2224/45124 (2013.01); H01L 23/49589 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10329 (2013.01); H01L 2224/48145 (2013.01); H01L 23/49548 (2013.01); H01L 2924/014 (2013.01); H01L 2225/06568 (2013.01); H01L 23/49541 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/01028 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/19105 (2013.01); H01L 2224/2919 (2013.01); H01L 23/49537 (2013.01); H01L 2924/14 (2013.01); H01L 2924/30107 (2013.01); H01L 23/3121 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/49433 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/29111 (2013.01); H01L 2924/01014 (2013.01); H01L 24/48 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/32145 (2013.01); H01L 23/4952 (2013.01); H01L 2924/01082 (2013.01); H01L 21/565 (2013.01); H01L 2924/01006 (2013.01);
Abstract
A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.