Greeley, CO, United States of America

Kirk Powell


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 2010-2016

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5 patents (USPTO):Explore Patents

Title: Kirk Powell: Innovator in Integrated Circuit Packaging

Introduction

Kirk Powell is a notable inventor based in Greeley, CO (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 5 patents. His work focuses on innovative designs that enhance the functionality and efficiency of electronic components.

Latest Patents

Kirk's latest patents include a leadless integrated circuit package featuring standoff contacts and a die attach pad. This design comprises an integrated circuit (IC) chip mounted on a die attach pad, with multiple electrical contacts connected to the IC chip. The entire assembly is encased in a molding material, with parts of the electrical contacts and die attach pad extending from the bottom surface. Another recent patent is for a leadless array plastic package that offers various IC packaging configurations. Similar to his previous patent, this design includes an IC chip mounted to a die-attach area, with electrical contacts covered by molding material.

Career Highlights

Kirk Powell is currently employed at Utac Hong Kong Limited, where he continues to innovate in the field of integrated circuits. His expertise and dedication have made him a valuable asset to the company.

Collaborations

Kirk has collaborated with talented coworkers such as John McMillan and Adonis Fung. Their combined efforts contribute to the advancement of technology in integrated circuit packaging.

Conclusion

Kirk Powell's contributions to integrated circuit packaging through his patents and collaborations highlight his role as an influential inventor in the electronics industry. His innovative designs continue to shape the future of technology.

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