Hong Kong, China

Kin Pui Kwan


Average Co-Inventor Count = 4.7

ph-index = 14

Forward Citations = 926(Granted Patents)


Company Filing History:


Years Active: 2003-2017

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18 patents (USPTO):Explore Patents

Title: Innovations by Inventor Kin Pui Kwan in Hong Kong

Introduction

Kin Pui Kwan is a prominent inventor based in Hong Kong, China, who has made significant contributions to the field of integrated circuit packaging. With a remarkable portfolio of 18 patents, he has demonstrated his expertise and innovation in developing advanced technologies that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among Kin Pui Kwan's notable recent patents are:

1. **Etch Isolation LPCC/QFN Strip** - This invention details various structures and fabrication methods for leadless plastic chip carrier (QFN) packages. His innovative approach uses carriers in strip format, where the leads are designed to be electrically isolated from each other within each unit, achieved through advanced chemical etching techniques.

2. **Method of Fabricating an Integrated Circuit (IC) Package Having a Plurality of Spaced Apart Pad Portions** - This process involves selectively etching a leadframe strip to create a die attach pad alongside multiple contact pads. The design includes spaced apart pad portions on at least one side of the die attach pad. A semiconductor die is then mounted to the die attach pad, and wire bonds are made to the contact pads, with the entire assembly encapsulated in molding material for protection.

Career Highlights

Kin Pui Kwan has worked with reputed companies, including A-sat Corporation and Utac Hong Kong Limited. His career has been marked by a commitment to advancing technologies in the electronics sector, particularly in integrated circuit packaging.

Collaborations

Throughout his career, Kin Pui Kwan has collaborated with notable professionals such as Chun Ho Fan and Kwok Cheung Tsang. These partnerships have played a crucial role in the development of his innovative inventions and have contributed to the success of his projects.

Conclusion

Kin Pui Kwan stands out as a visionary inventor in the competitive landscape of Hong Kong's technology sector. His extensive patent portfolio and successful collaborations highlight his significant impact on the field of integrated circuit packaging, solidifying his status as a leading innovator in his domain.

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