The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2007
Filed:
Dec. 22, 2004
Kin Pui Kwan, Tsz Ching Estate Kowloon, HK;
Wing Him Lau, Yuen Long, HK;
Kwok Cheung Tsang, Fauling, HK;
Chun Ho Fan, Shamtseng, HK;
Neil Mclellan, Danville, CA (US);
Kin Pui Kwan, Tsz Ching Estate Kowloon, HK;
Wing Him Lau, Yuen Long, HK;
Kwok Cheung Tsang, Fauling, HK;
Chun Ho Fan, Shamtseng, HK;
Neil McLellan, Danville, CA (US);
ASAT Ltd., Tsuen Wan, New Territories, HK;
Abstract
A process for fabricating a leadless plastic chip carrier includes selectively depositing a plurality of base layers on a first surface of a base of a leadframe strip to at least partially define a die attach pad and at least one row of contact pads. At least one further layer is selectively deposited on portions of the plurality of layers to further define at least the contact pads. The leadframe strip is then treated with a surface preparation. A semiconductor die is mounted to the die attach pad, followed by wire bonding the semiconductor die to at least the contact pads. Molding the semiconductor die, the wire bonds, the die attach pad and the contact pads on the surface of the leadframe strip, in a molding compound follows. The leadframe strip is etched to expose the contact pads and the die attach pad and the leadless plastic chip carrier is singulated from a remainder of the leadframe strip.