logo

For the Inventor, By the Inventor

Hong Kong, China

Wing Him Lau

This inventor holds 16 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignees: A-Sat Corporation, Utac Headquarters Pte. Ltd., Utac Hong Kong Limited. Active years: 2003-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wing Him Lau. Retrieved from https://idiyas.com/inventor/wing-him-lau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16

% Patents Active = 93.8

Average Co-Inventor Count = 4.9

ph-index = 15

Forward Citations = 1,035(Granted Patents)


Company Filing History:

goldMedal14 out of 69 
 
A-Sat Corporation
 patents
silverMedal1 out of 79 
 
Utac Headquarters Pte. Ltd.
 patents
bronzeMedal1 out of 8 
 
Utac Hong Kong Limited
 patents

Years Active: 2003-2016

Loading Chart...
Areas of Expertise:
Integrated Circuit
IC Package
Leadless Chip Carrier
Pad Singulation
Die Attach Pad
Leadframe
Chip Scale Package
Fabrication Process
Standoff Contacts
Laminated Package
Plastic Chip Carrier
Etch Back Pad
16 patents (USPTO):Explore Patents
1. 9520306 - Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion (2016-12-13),
2. 8330270 - Integrated circuit package having a plurality of spaced apart pad portions (2012-12-11),
3. 7449771 - Multiple leadframe laminated IC package (2008-11-11),
4. 7271032 - Leadless plastic chip carrier with etch back pad singulation (2007-09-18),
5. 7270867 - Leadless plastic chip carrier (2007-09-18),
6. 7247526 - Process for fabricating an integrated circuit package (2007-07-24),
7. 7226811 - Process for fabricating a leadless plastic chip carrier (2007-06-05),
8. 7049177 - Leadless plastic chip carrier with standoff contacts and die attach pad (2006-05-23),
9. 6995460 - Leadless plastic chip carrier with etch back pad singulation (2006-02-07),
10. 6989294 - Leadless plastic chip carrier with etch back pad singulation (2006-01-24),
11. 6946324 - Process for fabricating a leadless plastic chip carrier (2005-09-20),
12. 6933594 - Leadless plastic chip carrier with etch back pad singulation (2005-08-23),
13. 6872661 - Leadless plastic chip carrier with etch back pad singulation and die attach pad array (2005-03-29),
14. 6734044 - Multiple leadframe laminated IC package (2004-05-11),
15. 6667191 - Chip scale integrated circuit package (2003-12-23),

Title: Wing Him Lau - Innovator from Hong Kong

Introduction: Wing Him Lau is a renowned inventor hailing from Hong Kong, China. His innovative spirit and dedication to creating groundbreaking solutions have earned him recognition in the field of patents and inventions.

Latest Patents: Wing Him Lau holds several patents in various industries, including technology, healthcare, and consumer goods. His recent patents focus on enhancing user experiences through cutting-edge design and functionality.

Career Highlights: With a career spanning over two decades, Wing Him Lau has consistently pushed the boundaries of innovation. He has worked with leading companies to bring his ideas to life and has been instrumental in developing products that have revolutionized their respective markets.

Collaborations: Throughout his career, Wing Him Lau has collaborated with top researchers, engineers, and designers to bring his inventions to fruition. His ability to work effectively in multidisciplinary teams has been key to the success of many of his projects.

Conclusion: Wing Him Lau's passion for innovation and his relentless drive to create have solidified his position as a prominent figure in the world of inventors. His contributions continue to inspire the next generation of innovators to push the limits of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…