The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2003
Filed:
Aug. 05, 2002
Applicant:
Inventors:
Neil McLellan, Mid Levels, HK;
Wing Him Lau, Yuen Long, HK;
Tak Sang Yeung, Tin Shui Wai, HK;
Onofre A. Rulloda, Jr., Riviera Gardens, HK;
Assignee:
Asat Ltd., New Territories, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/334 ;
Abstract
An integrated circuit package including a silicon wafer, a plate of intermetallic compound fixed to the back surface of the silicon wafer and a plurality of solder ball contacts. The solder ball contacts are in electrical connection with die circuitry on the front surface of the silicon wafer.