Onofre A Rulloda, Jr

Title: Onofre A Rulloda, Jr: Innovator in Integrated Circuit Packaging

Introduction

Onofre A Rulloda, Jr. is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of electronic devices.

Latest Patents

Onofre A Rulloda, Jr. holds a patent for a chip scale integrated circuit package. This invention includes a silicon wafer, a plate of intermetallic compound fixed to the back surface of the silicon wafer, and a plurality of solder ball contacts. The solder ball contacts are in electrical connection with die circuitry on the front surface of the silicon wafer. This innovative design aims to improve the performance and reliability of integrated circuits.

Career Highlights

He is currently associated with A-sat Corporation, where he applies his expertise in integrated circuit technology. His work at the company has been instrumental in advancing the development of cutting-edge electronic components. With a focus on innovation, Onofre continues to push the boundaries of technology in his field.

Collaborations

Onofre A Rulloda, Jr. has collaborated with talented individuals such as Neil Robert McLellan and Wing Him Lau. These partnerships have fostered a creative environment that encourages the exchange of ideas and technological advancements.

Conclusion

Onofre A Rulloda, Jr. is a distinguished inventor whose work in integrated circuit packaging has made a significant impact on the electronics industry. His innovative patent and collaborations highlight his commitment to advancing technology.