The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Jun. 10, 2002
Applicant:
Inventors:
Chun Ho Fan, Sham Tseng, HK;
Tsui Yee Lin, Kowloon, HK;
Kin Pui Kwan, N.T., HK;
Shui Ming Tse, Sai Wan Ho, HK;
Wing Him Lau, Yuen Long N.T., HK;
Shuk Man Wong, Tai Kok KLN., HK;
Assignee:
ASAT Ltd., New Territories, HK;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.