This inventor holds 2 USPTO granted patents. Top assignee: A-Sat Corporation. Active years: 2004-2008.
Company Filing History:
Years Active: 2004-2008
Title: The Innovations of Shui Ming Tse
Introduction
Shui Ming Tse is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit packaging. With a total of 2 patents to his name, his work has had a considerable impact on the technology industry.
Latest Patents
One of Shui Ming Tse's latest patents is for a multiple leadframe laminated IC package. This innovative method involves providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe. This method enhances the efficiency and performance of integrated circuit packages.
Career Highlights
Shui Ming Tse is currently employed at A-Sat Corporation, where he continues to develop cutting-edge technologies. His expertise in integrated circuit packaging has positioned him as a key player in his field. His contributions are recognized not only for their technical merit but also for their practical applications in the industry.
Collaborations
Shui Ming Tse has worked alongside talented colleagues such as Chun Ho Fan and Shuk Man Wong. Their collaborative efforts have further advanced the innovations in integrated circuit technology.
Conclusion
Shui Ming Tse's work exemplifies the spirit of innovation in the technology sector. His patents and contributions to integrated circuit packaging demonstrate his commitment to advancing the field. His ongoing work at A-Sat Corporation continues to influence the industry positively.