The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2008
Filed:
Oct. 09, 2003
Applicants:
Chun Ho Fan, Sham Tseng, HK;
Tsui Yee Lin, Kowloon, HK;
Kin Pui Kwan, Hong Kong, HK;
Shui Ming Tse, Sai Wan Ho, HK;
Wing Him Lau, Hong Kong, HK;
Shuk Man Wong, Hong Kong, HK;
Inventors:
Chun Ho Fan, Sham Tseng, HK;
Tsui Yee Lin, Kowloon, HK;
Kin Pui Kwan, Hong Kong, HK;
Shui Ming Tse, Sai Wan Ho, HK;
Wing Him Lau, Hong Kong, HK;
Shuk Man Wong, Hong Kong, HK;
Assignee:
ASAT Ltd., Tsuen Wan, New Territories, HK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.