The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Oct. 30, 2003
Neil Mclellan, Danville, CA (US);
Chun Ho Fan, Sham Tseng, HK;
Kin Pui Kwan, Kowloon, HK;
Wing Him Lau, Yuen Long, HK;
Neil McLellan, Danville, CA (US);
Chun Ho Fan, Sham Tseng, HK;
Kin Pui Kwan, Kowloon, HK;
Wing Him Lau, Yuen Long, HK;
Asat Ltd., New Territories, HK;
Abstract
A process for fabricating a leadless plastic chip carrier includes laminating a first metal strip to a second metal strip to form a leadframe strip, selectively etching the first metal strip to define at least a row of contact pads, mounting a semiconductor die to either a die attach pad or the second metal strip and wire bonding the semiconductor die to ones of the contact pads, encapsulating a top surface of the leadframe strip in a molding material, removing the second metal strip, thereby exposing the die attach pad and the at least one row of contact pads, and singulating the leadless plastic chip carrier from the leadframe strip.