The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2006
Filed:
Jan. 28, 2003
Neil Mclellan, Hong Kong, HK;
Chun Ho Fan, Hong Kong, HK;
Kwok Cheung Tsang, Hong Kong, HK;
Kin Pui Kwan, Hong Kong, HK;
Wing Him Lau, Hong Kong, HK;
Neil McLellan, Hong Kong, HK;
Chun Ho Fan, Hong Kong, HK;
Kwok Cheung Tsang, Hong Kong, HK;
Kin Pui Kwan, Hong Kong, HK;
Wing Him Lau, Hong Kong, HK;
ASAT, Ltd., New Territories, HK;
Abstract
A leadless plastic chip carrier is constructed by half etching one or both sides of the package design onto a leadframe strip so as to create unique design features such as power and/or ground ring surrounding the die attach pad, interlocking rivet head construction for the contact pads, and an interlocking pattern for the die attach pad. After wire bonding and molding, a further etching is performed to isolate and expose contact pads. Singulation of individual chip packages from the leadframe strip is then performed by saw singulation or die punching.