This inventor holds 23 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignees: A-Sat Corporation, Utac Hong Kong Limited, Utac Headquarters Pte. Ltd.. Active years: 2002-2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Kowloon, CN (2016)
- Hong Kong, CN (2002 - 2017)
Company Filing History:
18 out of 69 
3 out of 8 
2 out of 78 Years Active: 2002-2017
Areas of Expertise:
Title: **Kwok Cheung Tsang: Innovator in Integrated Circuit Packages**
Introduction
Kwok Cheung Tsang is a prominent inventor based in Hong Kong, known for his contributions to the field of integrated circuit packaging. With a remarkable portfolio of 23 patents, Tsang has significantly influenced the design and fabrication methods of semiconductor devices. His work has paved the way for advancements in leadless plastic chip carrier (QFN) technologies.
Latest Patents
Among his latest innovations, Tsang has developed the patent titled "Etch isolation LPCC/QFN strip - Various structures and fabrication methods for leadless plastic chip carrier (QFN) packages." This patent focuses on utilizing carriers in strip format, where the leads are formed to be electrically isolated from one another. The units within the strip are also designed to be electrically isolated using chemical etching techniques.
Another notable patent from Tsang is the "Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion." This innovative process includes selectively etching a leadframe strip defined by a die attach pad and several contact pads. It involves mounting a semiconductor die to the die attach pad while ensuring that at least one side features spaced apart pad portions for effective connectivity.
Career Highlights
Kwok Cheung Tsang has worked with industry leaders, including A-Sat Corporation and UTAC Hong Kong Limited. His roles in these companies allowed Tsang to harness his skills in semiconductor packaging and contribute to innovative solutions that enhance device performance.
Collaborations
Throughout his career, Tsang has collaborated with talented individuals, including Chun Ho Fan and Neil McLellan. These partnerships have been instrumental in driving forward various research initiatives and patent developments within the semiconductor industry.
Conclusion
Kwok Cheung Tsang's innovative spirit and extensive patent portfolio solidify his status as a key inventor in the world of integrated circuit packaging. His contributions not only enhance technology but also set a benchmark for future innovations in the field. As the industry continues to evolve, Tsang's work remains pivotal in shaping advancements in semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile