The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2007
Filed:
Aug. 02, 2005
Neil Mclellan, Markham, CA;
Chun Ho Fan, Tsuen Wan, HK;
Kwok Cheung Tsang, Kowloon, HK;
Kin Pui Kwan, Kowloon, HK;
Neil McLellan, Markham, CA;
Chun Ho Fan, Tsuen Wan, HK;
Kwok Cheung Tsang, Kowloon, HK;
Kin Pui Kwan, Kowloon, HK;
ASAT Ltd., Tsuen Wan, New Territories, HK;
Abstract
A process for fabricating a pad frame for an integrated circuit package includes building up metal on selective portions of a first side of a substrate to define a plurality of contact pads disposed in a first layer of dielectric material, depositing a metal seed layer on an exposed side of the contact pads and the dielectric material, applying a second metal layer on the metal seed layer, selectively etching the second metal layer and the metal seed layer to provide pad frame circuitry, and building up metal on selective portions of the pad frame circuitry to define a plurality of die connect pads separated by a second layer of dielectric material, the die connect pads being electrically connected to the contact pads by the pad frame circuitry.