The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Oct. 03, 2003
Chun Ho Fan, Sham Tseng, HK;
Kwok Cheung Tsang, Fanling, HK;
William Lap Keung Chow, Kowloon, HK;
ASAT Ltd., Tsuen Wan, New Territories, HK;
Abstract
An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. The substrate further has a cavity therein and a heat slug is fixed to the substrate and spans the cavity. A semiconductor die is mounted to the heat slug such that at least a portion of the semiconductor die is disposed in the cavity. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulating material encapsulates the wire bonds and the semiconductor die. A ball grid array is disposed on the first surface of the substrate. Bumps of the ball grid array are in electrical connection with ones of the conductive traces.