The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Sep. 20, 2007
Applicants:

Tung Lok LI, Hong Kong, CN;

Kin Pui Kwan, Hong Kong, CN;

Inventors:

Tung Lok Li, Hong Kong, CN;

Kwok Cheung Tsang, Hong Kong, CN;

Kin Pui Kwan, Hong Kong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/4832 (2013.01); H01L 21/561 (2013.01); H01L 23/49582 (2013.01); H01L 24/97 (2013.01); H01L 23/3107 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48639 (2013.01); H01L 2224/48655 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/181 (2013.01);
Abstract

Various structures and fabrication methods for leadless plastic chip carrier (QFN) packages which utilize carriers in strip format, wherein the leads (or terminals) are formed to be electrically isolated from one another within each unit and in which the units are formed to be electrically isolated from one another within the strip using chemical etching techniques.


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