Tung Lok Li

Title: Innovations of Tung Lok Li: A Pioneer in Integrated Circuit Packaging

Introduction

Tung Lok Li is a notable inventor based in Hong Kong, CN, recognized for his significant contributions to the field of integrated circuit packaging. With a total of 12 patents to his name, he has made remarkable advancements in the design and manufacturing of leadless plastic chip carrier packages.

Latest Patents

Among his latest patents is the "Etch isolation LPCC/QFN strip," which details various structures and fabrication methods for leadless plastic chip carrier (QFN) packages. This innovation utilizes carriers in strip format, ensuring that the leads are electrically isolated from one another within each unit. The units are also designed to be electrically isolated from one another within the strip using chemical etching techniques. Another significant patent is the "Method of manufacturing leadless integrated circuit packages having electrically routed contacts." This method involves an IC chip mounted on a metal leadframe, with a plurality of electrical contacts electrically coupled to the IC chip. The encapsulation compound covers the IC chip, electrical contacts, and a portion of the metal leadframe, with some electrical contacts exposed on the bottom surface.

Career Highlights

Tung Lok Li has worked with several companies throughout his career, including QPL Limited and Kaixin, Inc. His work has been instrumental in advancing the technology behind integrated circuit packaging, making him a respected figure in the industry.

Collaborations

He has collaborated with notable coworkers such as John Robert McMillan and Xiao Ling Chen, contributing to various projects that have furthered the field of electronics.

Conclusion

Tung Lok Li's innovative patents and career achievements highlight his significant role in the development of integrated circuit packaging technologies. His work continues to influence the industry and pave the way for future advancements.