The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Jul. 29, 2009
Applicant:
Tung Lok LI, Hong Kong, HK;
Inventor:
Tung Lok Li, Hong Kong, HK;
Assignee:
Blondwich Limited, Hong Kong SAR, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.