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For the Inventor, By the Inventor

Arnhem, Netherlands

Walter De Munnik

This inventor holds 2 USPTO granted patents. Top assignees: Utac Headquarters Pte. Ltd., Utac Hong Kong Limited. Active years: 2012-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Walter De Munnik. Retrieved from https://idiyas.com/inventor/walter-de-munnik

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:

goldMedal1 out of 78 
 
Utac Headquarters Pte. Ltd.
 patents
silverMedal1 out of 8 
 
Utac Hong Kong Limited
 patents

Years Active: 2012-2016

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2 patents (USPTO):Explore Patents
1. 9520306 - Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion (2016-12-13),
2. 8330270 - Integrated circuit package having a plurality of spaced apart pad portions (2012-12-11),

Title: Walter de Munnik - Innovative Inventor from Arnhem

Introduction: Walter de Munnik is a renowned inventor hailing from Arnhem, Netherlands, known for his groundbreaking contributions to various fields of technology and science.

Latest Patents: Walter de Munnik holds several patents in the areas of renewable energy, sustainable materials, and advanced robotics, showcasing his commitment to creating solutions for the future.

Career Highlights: With a career spanning over two decades, Walter de Munnik has worked with leading research institutions and universities to develop cutting-edge technologies that have revolutionized industries worldwide.

Collaborations: Throughout his career, Walter de Munnik has collaborated with top companies, innovative startups, and talented individuals to bring his ideas to life and make a lasting impact on society.

Conclusion: Walter de Munnik's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the world of tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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