Utac Headquarters Pte. Ltd.

Utac Hong Kong Limited

Walter De Munnik

Chun Ho Fan

Neil McLellan

Kwok Cheung Tsang

Kin Pui Kwan

Wing Him Lau

Geraldine Tsui Yee Lin

A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pad and wires are bonded from the semiconductor die to respective ones of the contact pads. A first surface of the leadframe strip, including the semiconductor die and wire bonds, is encapsulated in a molding material such that at least one surface of the leadframe strip is exposed. The integrated circuit package is singulated from a remainder of the leadframe strip.

Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion

An integrated circuit package having a selectively etched leadframe strip defining a die attach pad and a plurality of contact pads, at least one side of the die attach pad having a plurality of spaced apart pad portions; a semiconductor die mounted to the die attach pad and wires bonding the semiconductor die to respective ones of the contact pads; a first surface of the leadframe strip, including the semiconductor die and wire bonds, encapsulated in a molding material such that at least one surface of the leadframe strip is exposed, and wherein solder paste is disposed on said contact pads and said at least one side of said die attach pad.

Integrated circuit package having a plurality of spaced apart pad portions

Growing community of inventors

Arnhem, Netherlands

Walter De Munnik