Wai Kit Tam

Title: Innovations of Wai Kit Tam

Introduction

Wai Kit Tam is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on improving the thermal characteristics of electronic components, which is crucial for enhancing the performance and reliability of modern technology.

Latest Patents

One of Wai Kit Tam's latest patents is a ball grid array package with improved thermal characteristics. This integrated circuit package features a substrate with first and second surfaces, along with a plurality of conductive traces. A semiconductor die is mounted on the first surface of the substrate, and wire bonds connect the die to the conductive traces. An encapsulant surrounds the wire bonds and the semiconductor die, while a heat spreader is designed with a cap that extends inwardly toward the semiconductor die. The encapsulant fills the space between the cap and the die, ensuring efficient heat dissipation. Additionally, a ball grid array is located on the second surface of the substrate, with bumps in electrical connection to the conductive traces.

Career Highlights

Wai Kit Tam is currently employed at Utac Hong Kong Limited, where he continues to innovate in the field of semiconductor packaging. His expertise in thermal management and integrated circuit design has positioned him as a valuable asset to his company.

Collaborations

Wai Kit Tam has collaborated with several talented individuals in his field, including Neil McLellan and Ming Wang Sze. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Wai Kit Tam's contributions to the field of integrated circuit packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of thermal management, which is essential for the advancement of electronic devices.